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 Publisher: Inderscience Publishers

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 Publisher: American Society for Engineering Education

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 Publisher: Association for the Development of Science, Engineering and Education

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Publisher: Blackwell Publishing Inc.

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Publisher: Dublin Institute of Technology Tempus Publications

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 Publisher: Elsevier Ltd.

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 Publisher: Emerald Group Publishing Ltd.

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 Publisher: Higher Education Academy

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Publisher: Idea Group Publishing

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Publisher: IEEE Computer Society

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Publisher: John Wiley & Sons Inc.

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 Publisher: Kluwer Academic Publishers

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 Publisher: Nature Publishing Group

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 Publisher: OmniaScience

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 Publisher: Purdue University Press

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Publisher: SAGE Publications

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Publisher: Springer

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Publisher: Taylor and Francis Ltd.

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 Publisher: Technology Education Program, Virginia Polytechnic Institute and State University

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 Publisher: Wiley-Blackwell

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 Publisher: World Institute for Engineering and Technology Education (WIETE)

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Conferences

 2019

July:

  The 3rd International STEM Education Conference: (iSTEM-Ed 2018)

  Important Dates
Paper submission deadline: April 15, 2018
Acceptance announcement: May 01, 2018
Camera-ready submission deadline: May 25, 2018
Pre-registration deadline: May 25, 2018

  July 11 – 13, 2018 (Conference Opening).

 Electrical Engineering Academic Association (Thailand),
140 Chueam-Chumphun Rd, Kratamrai, Nong-Chok, Bangkok, 10530 Thailand

  Website: http://istem-ed.com/istem-ed2018

 

November:

  2018 Global Wireless Summit (GWS)

  November 25 – 28, 2018 (Conference Opening).

  Mae Fah Luang University, 333 Moo 1, Thasud, Muang, Chiang Rai, Thailand.

  Website: http://www.mfu.ac.th/gws2018 or https://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=43302